The HeiChips Summer School 2026 will take place August 3–7, 2026, in Heidelberg. It is designed for students, PhD candidates, and anyone interested in gaining hands-on experience with open-source chip design.
Participants will enjoy a full week of expert lectures, practical workshops, and a hackathon where they will develop their own ASIC designs using state-of-the-art open-source tools. Topics include the IHP 130 nm Open Source PDK, digital ASIC design, and the complete design flow from RTL to silicon.
Participation is free of charge thanks to the support of Heidelberg University, the German Federal Ministry of Research, Technology and Space (BMFTR), and Chipdesign Germany. Please note that travel and accommodation are not included.
Important: All regular places have already been filled. Registration is currently only possible via the waiting list.
Further information and the waiting list are available at: https://heichips.github.io/
We are looking forward to welcoming participants from around the world to Heidelberg for an exciting week of learning, collaboration, and innovation in open-source hardware.